Specialist Task Force 500:
Validation of the Conformance Test Specifications for the Diameter Protocol over the Cx and Dx reference points
Who we are:
What we do
STF 500 is validating the TTCN-3 Conformance Test Suites produced by TC INT for Diameter Cx and Dx interfaces:
For more details, see our Terms of Reference
Why we do it
The main goal is to ensure that the Conformance Test Specifications for Diameter Cx and Dx are bug free and offer the highest quality.
How we do it
The first task of the STF is to integrate the Cx and Dx Test Suites in the existing Diameter Test Framework (already covering Gx and Rx, S6a and S9 interfaces) by extending the test platform (Codec and Test Adaptors) as required to run the new Test Suites.
Then, a short phase of pre-validation is foreseen, which consists in running the Test Suites against a simulator playing the appropriate role: CDF, CTF and OCF, as required. This pre-validation ensures that the Test Suites and Test System are ready to be run against real equipment from the industry.
Finally, a number of test sessions will be run, in which the Test System will run the Test Suites against different network equipment from the industry. In that regard, we are currently looking for validation partners to support the validation sessions with CDF, CTF and OCF implementing Cx and Dx as per 3GPP TS 32.260 and TS 29.299 (Rel. 10).
While participating to this project on a voluntary basis, equipment vendors will be able to assess the conformance of their implementation with the 3GPP Rel. 10 standards for Cx and Dx.
Test sessions can be run remotely by connecting the vendor’s equipment to the test system via VPN or locally, with the STF experts travelling to the vendor’s lab.
If you are interested in this opportunity, please send your request for participation to firstname.lastname@example.org, with the subject including [STF500 – Request for participation].
The STF is foreseen to produce a new version of the Conformance Test Specifications for Diameter Cx and Dx:
TS 103 289-1 Diameter Conformance testing for Cx and Dx interfaces; (3GPP Release 10); Part 1: Protocol Implementation Conformance Statement (PICS)
TS 103 289-2 Diameter Conformance testing for Cx and Dx interfaces; (3GPP Release 10); Part 2: Test Suite Structure (TSS) and Test Purposes (TP)
TS 103 289-3 Diameter Conformance testing for Cx and Dx interfaces; (3GPP Release 10); Part 3: Abstract Test Suite (ATS) and partial Protocol Implementation eXtra Information for Testing (PIXIT) proforma specification
The corresponding TTCN-3 Test Suites can also be found in the ETSI Forge.
The STF time plan includes the following milestones:
Milestone 1 – First Progress Report on Validation Activities
Approval of Progress Report by INT#31 (Dec 2015) plenary
Milestone 2 – Second Report on Validation Activities
Approval of Progress Report by INT#32 (Mar 2016) plenary
Milestone 3 –Approval of all revised documents, STF Final Report
Approval of final drafts of PICS, TSS&TP and ATS&PIXIT by INT#33 (Jun 2016) plenary
Approval of Final Report by INT#33 (Jun 2016) plenary
If you would like to know further details, or would like to provide equipment for the validation sessions, please contact the STF leader by email.