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Work Item Reference |
ETSI Doc. Number |
STF |
Technical Body in Charge |
Download Standard
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DTS/SCP-T90361
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TS 103 818
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SET TEC
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Current Status (Click to View Full Schedule) |
Latest Version
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Cover Date |
Standstill |
Creation Date |
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Publication (2022-04-22)
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17.0.0
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2022-04-22
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View Standstill Information
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2021-04-21
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|
Rapporteur |
Technical Officer |
Harmonised Standard |
|
|
Giulio Follero
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Sylwia Korycinska-Bensaid
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No
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Title
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Smart Secure Platform (SSP); I3C® interface (Release 17)
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Scope and Field of Application
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This work item creates a specification for the I3C interface, based on the requirements described in TS 103 465, that uses the MIPI I3C specification as reference. It defines (but is not limited to): - The definition of the electrical characteristics. - The definition of the MAC Layer. - The definition of the link layer. - The definition of the conditions for entry into and exit from power saving modes. The evaluation of existing standardised mechanisms will be performed in order to assess possible reuse and extension.
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Supporting Organizations
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THALES, STMicroelectronics, Qualcomm CDMA Technologies, VALID SOLUCIONES TECNOLÓGICAS, INFINEON TECHNOLOGIES, Huawei Technologies France, G+D MS, IDEMIA
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