2024-06-27 | Work Programme | Version 2.3.3 |
Work Item Reference | ETSI Doc. Number |
STF | Technical Body in Charge |
Standard Not Ready For Download |
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DGR/THz-004 | GR THz 004 | THz | |||||
Current Status (Click to View Full Schedule) |
Latest Version |
Cover Date | Standstill | Creation Date | |||
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0.0.3 Draft | View Standstill Information | 2022-12-16 | ||||
Rapporteur | Technical Officer | Harmonised Standard | |||||
Sharad Sambhwani | Muhammad Tayyeb | No | |||||
Title |
TeraHertz technology (THz); RF Hardware Modeling RF Hardware Modeling |
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Scope and Field of Application |
This work item will: (i) Assess the state-of-the-art materials for THz communication e.g., electronics, photonics, plasmonics (ii) Study the feasibility of different channel bandwidths considering component technologies, circuits and systems (iii) Study the effects of non-linear and frequency selective hardware (iv) Characterize RF/analog impairments based on simulations/measurements and obtain suitable RF impairment models in THz frequency range (v) Study low complexity large antenna array and packaging technologies (vi) Assess overall device complexity and cost impact (vii) Study the state of art for RF subsystems (transceiver, front end, antenna) in the THz frequency range (viii) Study the energy efficiency of state-of-the-art materials and RF subsystems on transmission and/or reception. | ||||||
Supporting Organizations |
Apple France, B-Com, HUAWEI TECH. GmbH, InterDigital, Europe, Ltd., TUBS.digital |
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Keywords | Projects | Clusters | Frequencies | Mandates | Directives | ||||||||||||||||||||||||||||
channel bandwidths cost impact device complexity frequency range large antenna array RF HW models RF/analog impairments THz component technologies THz materials transceiver efficiency |
Networks Wireless Systems |
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Official Journal |
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Remarks |
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