| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)067002 | Report WG4 #67 | Reserved | Chair | Report |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)067001 | Agenda WG4 #67 | Available | Chair | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)066005 | ITSWG4(24)065005_TS_102_792_v123i_comments_Audi | Available | Audi | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)066004 | Derivation of protected zone radius for TS 102 792 | Available | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)066003 | Application of Kai Achtmann for the position of WG4 Vice-Chair and WG4 Secretary | Available | ETSI Secretariat | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)066002 | Report WG4 #66 | Accepted | Chair | Report |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)066001r1 | Agenda WG4 #66 | Available | Chair | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)066001 | Agenda WG4 #66 | Revised | Chair | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)065005r1 | TS 102 792 as outcome of ITSWG4#65 | Available | Rapporteur | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)065005 | TS 102 792 as outcome of ITSWG4#65 | Revised | Rapporteur | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)065004 | Draft - DTS/ITS-00450 v0.0.2 (TS 103 969 ) "5G-V2X Access Layer Testing" | Available | Qualcomm Germany | Draft |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)065003 | Protected zone radius in TS 102 792 | Available | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)065002r1 | Report WG4#65 | Accepted | Chair | Report |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)065002 | Report WG4#65 | Revised | Volvo Technology Corporation | Report |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)065001r2 | Agenda WG4 #65 | Available | Volvo Technology Corporation | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)065001r1 | Agenda WG4 #65 | Revised | Volvo Technology Corporation | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)065001 | Agenda WG4 #65 | Revised | Volvo Technology Corporation | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000024 | TS 102 792 as outcome of drafting session #12 | Available | Rapporteur | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000023 | Minutes of ITSWG4 TS 102 792 (road toll coexistence) drafting #12 | Available | Rapporteur | Report |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000022 | Agenda for ITSWG4 TS 102 792 (road toll coexistence) drafting #12 | Available | Rapporteur | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000021 | Draft - REN/ITS-00446 v2.0.2 (EN 303 798 ) "NR-V2X access layer" | Noted | ETSI Secretariat | Draft |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000020r1 | en_303798v020001a_with_ENAP_comments_rapporteur_compilation_pA11 | Accepted | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000020 | en_303798v020001a_with_ENAP_comments_rapporteur_compilation_pA11 | Revised | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000019r1 | Comments_ENAP_NR_Access_Layer_rapporteur_compilation_pA11 | Accepted | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000019 | Comments_ENAP_NR_Access_Layer_rapporteur_compilation_pA11 | Revised | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000018 | Comments_ENAP_NR_Access_Layer_rapporteur_amendment_pA11 | Available | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000017 | TS 102 792 as outcome of drafting session #11 | Available | Rapporteur | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000016 | Report EN 303 798 comments resolution meeting #3 | Reserved | Chair | Report |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000015r2 | Agenda EN 303 798 comments resolution meeting #3 | Available | Chair | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000015r1 | Agenda EN 303 798 comments resolution meeting #3 | Revised | Chair | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000015 | Agenda EN 303 798 comments resolution meeting #3 | Revised | Chair | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000014 | Comments_ENAP_NR_Access_Layer_rapporteur_amendment_pA9 | Available | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000013 | Minutes of ITSWG4 TS 102 792 (road toll coexistence) drafting #11 | Available | Rapporteur | Report |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000012r1 | Agenda for ITSWG4 TS 102 792 (road toll coexistence) drafting #11 | Available | Rapporteur | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000012 | Agenda for ITSWG4 TS 102 792 (road toll coexistence) drafting #11 | Revised | Rapporteur | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000011 | Report EN 303 798 comments resolution meeting #2 | Reserved | Chair | Report |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000010r1 | Agenda EN 303 798 comments resolution meeting #2 | Available | Chair | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000010 | Agenda EN 303 798 comments resolution meeting #2 | Revised | Chair | Agenda |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000009r5 | en_303798v020001a_with_ENAP_comments_rapporteur_compilation_pA11 | Reserved | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000009r4 | en_303798v020001a_with_ENAP_comments_rapporteur_compilation_pA9 | Revised | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000009r3 | en_303798v020001a_with_ENAP_comments_rapporteur_compilation_pA9 | Revised | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000009r2 | en_303798v020001a_with_ENAP_comments_rapporteur_compilation_pA6 | Revised | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000009r1 | en_303798v020001a_with_ENAP_comments_rapporteur_compilation_pA6 | Revised | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000009 | en_303798v020001a_with_ENAP_comments_rapporteur_compilation_pA1 | Revised | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000008r4 | Comments_ENAP_NR_Access_Layer_rapporteur_compilation_pA9 | Available | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000008r3 | Comments_ENAP_NR_Access_Layer_rapporteur_compilation_pA9 | Revised | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000008r2 | Comments_ENAP_NR_Access_Layer_rapporteur_compilation_pA6 | Revised | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000008r1 | Comments_ENAP_NR_Access_Layer_rapporteur_compilation_pA6 | Revised | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000008 | Comments_ENAP_NR_Access_Layer_rapporteur_compilation_pA1 | Revised | Qualcomm Germany | Other |
| ![View Contribution Details](Img/ViewDetails.png) ![](Img/blank.gif) ![](Img/blank.gif) ![](Img/blank.gif) | ITSWG4(24)000007 | Comments ENAP NR Access Layer Qualcomm | Available | Qualcomm Germany | Other |